AustriaElectronics
Silicon Austria Labs – Chips JU: plasma activation system for die-to-wafer bonding
A plasma activation system is being procured for die-to-wafer (D2W) bonding. The equipment is used in semiconductor manufacturing to prepare surfaces before chips are bonded to a wafer.
- Estimated value
- €790,621
- Published
- 5 Aug 2026
- CPV
- 38000000
Get help from a local consultant
Bidding cross-border? A Baltmodus consultant who works in this market can help you prepare and submit.
Find a consultant